LSRFSBKS2362 doc. no : qw0905-LSRFSBKS2362 rev. : a date : 06 - oct - 2008 data sheet ligitek electronics co.,ltd. property of ligitek only pb lead-free parts bipolar type led lamps
25.0min 2 1 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min directivity radiation 2.54typ 1 2 ligitek electronics co.,ltd. property of ligitek only 3.0 5.0 0.5 typ 1.5max package dimensions LSRFSBKS2362 part no. sbks srf page1/6 75% 100% -60 25% 25% 50%050%100% 75% -30 0 60 30
t opr -20 ~ +80 operating temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LSRFSBKS2362 red ingan/sic blue white diffused emitted lens 15 2.4 ---- 1.5 630 20 475 26 4.2 ---- 3.5 max. min. typ. min. 100 38 100 typ. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. luminous intensity @20ma(mcd) typical electrical & optical characteristics (ta=25 ) part no dominant wave length dnm material color spectral halfwidth nm forward voltage @20ma(v) storage temperature * tstg -30 ~ +100 viewing angle 2 1/2 (deg) 30 30 i f forward current peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) power dissipation esd ir 2000 500 10 50 pd i fp 75 120 90 100 absolute maximum ratings at ta=25 ratings parameter symbol sbks srf ma v a mw ma unit ligitek electronics co.,ltd. property of ligitek only page 2/6 LSRFSBKS2362 part no. algainp 120220
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 550600 0.5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 40 020 1.1 1.0 0.9 1.2 700 650 ambient temperature( ) fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 -40 100 80 60 0.0 0 -20 4060 20 1.5 1.0 2.0 2.5 3.0 80100 forward voltage(v) fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 100 2.0 1.0 0.1 3.0 1.0 10 srf chip 1000 fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 4.05.0 0.0 0.5 1.0 1.5 2.0 forward current(ma) 10100 2.5 3.0 1000 ligitek electronics co.,ltd. property of ligitek only 3/6 page LSRFSBKS2362 part no.
4/6 page ligitek electronics co.,ltd. property of ligitek only 1.25 1.5 fig.2 relative intensity vs. forward current 20 101525 30 0.5 0.75 0.25 0 forward voltage(v) 5 0 3 45 forward current(ma) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 sbk-s chip 20 25 30 15 10 5 0 1 f o r w a r d c u r r e n t ( m a ) typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 2 1.0 0.5 fig.4 relative intensity vs. wavelength wavelength (nm) 75 50100 r e l a t i v e i n t e n s i t y @ 2 0 m a 580 380 0 480 480 430 530 630 680 30 40 20 10 0 f o r w a r d c u r r e n t @ 2 0 m a 0 fig.3 forward current vs. temperature ambient temperature( ) 25 LSRFSBKS2362 part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 60 seconds max 0 0 25 preheat 2 /sec max 50 100 260 temp( c) 260 c3sec max 5 /sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 5/6 note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LSRFSBKS2362 part no.
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: test itemtest condition description page 6/6 LSRFSBKS2362 part no.
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